CHEMICAL
|
PROPERTY
|
BASE
|
BASE
|
Bis GMA
|
Resin Phase
|
2- 4 Di-hydroxybenzophenone
|
Ultra-violet absorber
|
N, N Dihydroxy Ethyl p-Toluidine
|
Resin Phase
|
Dihydroxy Ethyl p-Toluidine
|
Auto cure
|
1, 5 Hexane-Diol-Dimethacrylate
|
Resin phase
|
Ethoxylated Bis-Phenol "A" Dimethacrylate
|
Resin phase
|
N, N Dimethylaminoethyl Methacrylate
|
Photo cure
|
Camphorquinone
|
Photo cure
|
Sodium Fluoride
|
Caries inhibitor
|
Fumed Silica
|
Sub-micron filler
|
Barium Glass
|
Small particle radiopaque filler
|
CATALYST
|
CATALYST
|
Bis GMA
|
Resin phase
|
BHT
|
Polymerization inhibitor
|
Benzoyl Peroxide
|
Polymerization inhibitor
|
Triethylene Glycol Dimethacrylate
|
Rein phase
|
Aluminum Oxide
|
Filler
|
Fumed Silica
|
Sub-micron filler
|
Barium Glass
|
Small particle radiopaque filler
|
UNFILLED RESIN (Enamel Bonding Agent)
|
UNFILLED RESIN
|
Bis GMA
|
Resin phase
|
BHT
|
Polymerization inhibitor
|
Triethylene Gylcol Dimethacrylate
|
Resin phase
|
N, N Dimethylaminoethyl Methacrylate
|
Photo cure
|
Benzil
|
Photo cure
|
N, N Dihydroxy Ethyl p-Toluidine
|
Auto cure
|
Resin/Filler Ratio Pct. of Composite
|
Catalyst 38/62
Base 41/59
|
Filler Size of Composite
|
Sub Micron to 5 microns
|
Work Time
|
3' 00"
|
Set Time
|
10" 00"
|
Film Thickness of Composite
|
25 microns
|
Diametral Tensile Strength of Composite
|
5,000 psi
|
Bond Strength of Composite to Etched Enamel with a layer of Enamel Bonding Agent
|
40 MPa
|
Bond Strength of Confi-Quick One Part to etched dentin
|
30 MPa
|
